B-Micron provides a full suite of wafer-level and device-level bonding and packaging solutions, ensuring strong mechanical integrity, hermetic sealing, and electrical interconnection for MEMS, microfluidics, photonics, and medical devices. We support both R&D prototyping and scalable production, without requiring upfront setup fees.

Wafer & Substrate Bonding

• Anodic Bonding: High-strength hermetic bonding between silicon and glass, ideal for MEMS cavities, microfluidic sealing, and pressure sensors.

• Fusion Bonding: Direct silicon-to-silicon wafer bonding for ultra-clean, defect-free interfaces.

• Eutectic Bonding: Metal-to-metal bonding (e.g., Au-Si, Au-Sn) with excellent thermal and electrical conductivity.

• Thermo-Compression Bonding: Solid-state bonding under heat and pressure, suitable for interconnects and hybrid device assembly.

• Plasma-Activated Bonding: Surface activation with plasma enables low-temperature bonding of wafers and polymers.

• UV Bonding: Fast, low-temperature bonding of UV-curable adhesives, supporting polymer substrates and optical alignment.

• Polymer & Adhesive Bonding: Epoxy, BCB, and other polymers used for flexible integration of microfluidics, sensors, and MEMS.

• Metal Bonding: Advanced techniques for metal-to-metal interfaces, supporting RF, MEMS, and power device applications.

Device Packaging & Interconnects

• Wire Bonding: Gold, aluminum, or copper wire bonding for reliable electrical interconnection of MEMS and ICs.

• Encapsulation: Hermetic and non-hermetic sealing for environmental protection and biocompatibility.

• Custom Packaging: Tailored packages designed for optical alignment, fluidic interfacing, or harsh operating environments.

Applications Across Industries - Our bonding and packaging processes enable:

• MEMS sensors and actuators requiring hermetic sealing and electrical interconnects.

• Microfluidic consumables bonded to glass, silicon, or polymers for reliable bioassays.

• Photonic devices needing precise alignment and low-loss packaging.

• MedTech components requiring biocompatible sealing and sterilization-ready packaging.

With B-Micron’s bonding and packaging expertise, clients can confidently move from lab-scale prototypes to production-ready devices, ensuring durability, performance, and manufacturability.