From design to packaged device, we support your full MEMS journey or individual fabrication needs.
Collaborative MEMS design
Partner with our engineering team to co-develop MEMS solutions tailored to your device requirements, from early concept through final layout.
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Deposition, Oxidation & Plating
Thin-film deposition, oxidation layers, and electroplating services for functional and structural MEMS layers.
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Mask Fabrication
High-precision mask making to ensure accuracy and consistency across MEMS production processes.
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Bonding & Packaging
Wafer-to-wafer and chip-level bonding, plus MEMS packaging solutions to enable robust device integration.
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Photolithography
Advanced lithography services for defining micro- and nanoscale patterns with high fidelity.
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Metrology
Comprehensive inspection, measurement, and characterization to validate device geometry, performance, and quality.
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Collaborative MEMS design
Partner with our engineering team to co-develop MEMS solutions tailored to your device requirements, from early concept through final layout.
Learn More >
Deposition, Oxidation & Plating
Thin-film deposition, oxidation layers, and electroplating services for functional and structural MEMS layers.
Learn More >
Mask Fabrication
High-precision mask making to ensure accuracy and consistency across MEMS production processes.
Learn More >
Bonding & Packaging
Wafer-to-wafer and chip-level bonding, plus MEMS packaging solutions to enable robust device integration.
Learn More >
Photolithography
Advanced lithography services for defining micro- and nanoscale patterns with high fidelity.
Learn More >
Metrology
Comprehensive inspection, measurement, and characterization to validate device geometry, performance, and quality.
Learn More >
Collaborative MEMS design
Partner with our engineering team to co-develop MEMS solutions tailored to your device requirements, from early concept through final layout.
Learn More >
Photolithography
Advanced lithography services for defining micro- and nanoscale patterns with high fidelity.
Learn More >
Dry Etching
Plasma and reactive ion etching (RIE/DRIE) capabilities for high-aspect-ratio structures and complex geometries.
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Bonding & Packaging
Wafer-to-wafer and chip-level bonding, plus MEMS packaging solutions to enable robust device integration.
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Micro-Replication Services
High-volume replication of microstructures using molding and embossing for scalable manufacturing.
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Mask Fabrication
High-precision mask making to ensure accuracy and consistency across MEMS production processes.
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Wet Etching
Controlled chemical etching techniques for precise material removal and high-quality surface finishes.
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Deposition, Oxidation & Plating
Thin-film deposition, oxidation layers, and electroplating services for functional and structural MEMS layers.
Learn More >
Metrology
Comprehensive inspection, measurement, and characterization to validate device geometry, performance, and quality.
Learn More >
Wafer Backend Process
Dicing, thinning, and backend processing services to prepare wafers for final device integration and assembly.
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