B-Micron provides comprehensive metrology services to ensure device accuracy, reliability, and compliance at every stage of MEMS and microdevice development. From thin-film thickness to nanoscale surface features, our in-house tools enable precise characterization and quality control without requiring upfront setup fees.

Surface & Profile Measurement

• Confocal Microscopy: High-resolution 3D imaging of surfaces, enabling detailed inspection of microstructures and step heights.

• Profilometry: Accurate surface topography and step height measurement for films, etch depths, and micro-patterns.

Imaging & Microanalysis

• Optical Microscopy: Rapid inspection and defect detection across wafers, devices, and microfluidic channels.

• Scanning Electron Microscopy (SEM / FESEM): High-magnification imaging down to the nanoscale, revealing fine structural details.

• Focused Ion Beam (FIB): Cross-sectional analysis and micro-sample preparation for in-depth structural evaluation.

Advanced Characterization

• Material & Film Analysis: Layer thickness, uniformity, and defect characterization.

• Dimensional Verification: Ensures fidelity of fabricated structures to design specifications.

• Failure Analysis: Identifies defects or process deviations, accelerating process improvement and yield optimization.

Applications - Our metrology capabilities support:

• MEMS device dimensional accuracy and defect inspection.

• Microfluidic chip channel depth, uniformity, and bonding validation.

• Photonic and optoelectronic structure alignment and surface roughness control.

• Biotech consumable QA/QC for reproducibility and regulatory readiness.

With our advanced metrology and characterization tools, B-Micron ensures that every step of fabrication is validated, helping clients achieve higher yields, reliable performance, and faster product development cycles.