B-Micron provides comprehensive backend services to prepare wafers and individual dies for packaging, testing, and integration into final products. Our backend capabilities ensure device reliability, scalability, and compatibility with downstream manufacturing processes.

Capabilities

• Wafer Dicing: High-precision dicing for clean, accurate separation of devices with minimal chipping and damage.

• Wafer Thinning (Lapping & CMP): Mechanical lapping and chemical-mechanical polishing (CMP) to achieve ultra-thin wafers with smooth, defect-free surfaces.

• Through-Holes & Vias: Fabrication of vertical interconnects or access points for electrical and fluidic integration.

• Surface Modification (Wettability Control): Tailored hydrophobic or hydrophilic surface treatments to optimize fluid flow, adhesion, or biocompatibility.

• Pick-and-Place: Accurate die handling and transfer for assembly, packaging, or testing workflows.

Advantages

• End-to-End Workflow: Backend processes seamlessly complement our front-end MEMS fabrication and packaging services.

• High Yield & Reliability: Careful control of thinning, dicing, and handling minimizes breakage and enhances device performance.

• Customization: Surface treatments and thru-hole integration allow adaptation for specialized applications such as microfluidics, sensors, and RF devices.

• Scalability: Flexible backend support for prototyping, pilot runs, and full-scale production.

Applications

• Microfluidics: Surface modification for controlled wettability and flow dynamics.

• Photonics & Optoelectronics: Wafer thinning for optical coupling and integration.

• Sensors & Actuators: Through-holes and precision dicing for robust MEMS packaging.

• Medical Devices: Pick-and-place handling for consumables and implantable devices.

With expertise in dicing, thinning, surface engineering, and die handling, B-Micron ensures wafers are fully prepared for packaging and deployment in advanced microsystems.