MEMS Foundry
Capability - Deposition, Oxidation & Plating
MEMS Foundry
Capability - Deposition, Oxidation & Plating
B-Micron provides a full spectrum of thin film and material deposition capabilities, enabling the creation of conductive, insulating, and functional layers critical for MEMS, photonics, microfluidics, and advanced microsystems. Our processes are optimized for high uniformity, adhesion, and reproducibility, without upfront setup fees.
• Electroplating: Nickel (Ni) and copper (Cu) electroplating for creating high-aspect-ratio features, interconnects, micro-coils, and shielding structures.
• Applications: MEMS inductors, RF devices, structural reinforcement, and micro-actuators.
• Thermal Oxidation: Dry and wet oxidation of silicon for precise SiO₂ layer growth, ensuring high-quality insulating and passivation layers.
• Applications: device isolation, gate oxides, surface passivation, and microfluidic channel sealing.
• LPCVD (Low Pressure Chemical Vapor Deposition): Deposition of SiO₂, SiNₓ, polysilicon, and amorphous silicon with excellent step coverage and film uniformity.
• Applications: sacrificial layers, structural layers, stress-control films, and waveguide cores.
• PECVD (Plasma Enhanced Chemical Vapor Deposition): SiO₂ and SiNₓ films deposited at lower temperatures, ideal for applications requiring compatibility with polymers and temperature-sensitive substrates.
• Applications: encapsulation layers, dielectric layers, optical coatings.
• E-beam Evaporation: High-purity deposition of metals and conductive oxides, including Cr, Al, Ni, Au, Pt, Mo, Cu, and ITO.
• Applications: electrodes, reflective coatings, adhesion layers, biosensor interfaces, and optoelectronic devices.
• Sputtering: Deposition of Cr, Al, Ni, Au, Pt, Cu, ITO, and more, offering strong adhesion and excellent control over film thickness and uniformity.
• Applications: seed layers, transparent conductors, interconnects, and barrier films.
Applications Across Markets: These processes collectively support the fabrication of MEMS sensors and actuators, RF communication devices, photonic waveguides, microfluidic chips, and bio-MEMS platforms. By combining electroplating, oxidation, CVD, and PVD methods, we give customers the flexibility to build both structural and functional device layers tailored to their application.
B-Micron provides a full spectrum of thin film and material deposition capabilities, enabling the creation of conductive, insulating, and functional layers critical for MEMS, photonics, microfluidics, and advanced microsystems. Our processes are optimized for high uniformity, adhesion, and reproducibility, without upfront setup fees.
• Electroplating: Nickel (Ni) and copper (Cu) electroplating for creating high-aspect-ratio features, interconnects, micro-coils, and shielding structures.
• Applications: MEMS inductors, RF devices, structural reinforcement, and micro-actuators.
• Thermal Oxidation: Dry and wet oxidation of silicon for precise SiO₂ layer growth, ensuring high-quality insulating and passivation layers.
• Applications: device isolation, gate oxides, surface passivation, and microfluidic channel sealing.
• LPCVD (Low Pressure Chemical Vapor Deposition): Deposition of SiO₂, SiNₓ, polysilicon, and amorphous silicon with excellent step coverage and film uniformity.
• Applications: sacrificial layers, structural layers, stress-control films, and waveguide cores.
• PECVD (Plasma Enhanced Chemical Vapor Deposition): SiO₂ and SiNₓ films deposited at lower temperatures, ideal for applications requiring compatibility with polymers and temperature-sensitive substrates.
• Applications: encapsulation layers, dielectric layers, optical coatings.
• E-beam Evaporation: High-purity deposition of metals and conductive oxides, including Cr, Al, Ni, Au, Pt, Mo, Cu, and ITO.
• Applications: electrodes, reflective coatings, adhesion layers, biosensor interfaces, and optoelectronic devices.
• Sputtering: Deposition of Cr, Al, Ni, Au, Pt, Cu, ITO, and more, offering strong adhesion and excellent control over film thickness and uniformity.
• Applications: seed layers, transparent conductors, interconnects, and barrier films.
Applications Across Markets: These processes collectively support the fabrication of MEMS sensors and actuators, RF communication devices, photonic waveguides, microfluidic chips, and bio-MEMS platforms. By combining electroplating, oxidation, CVD, and PVD methods, we give customers the flexibility to build both structural and functional device layers tailored to their application.
B-Micron provides a full spectrum of thin film and material deposition capabilities, enabling the creation of conductive, insulating, and functional layers critical for MEMS, photonics, microfluidics, and advanced microsystems. Our processes are optimized for high uniformity, adhesion, and reproducibility, without upfront setup fees.
• Electroplating: Nickel (Ni) and copper (Cu) electroplating for creating high-aspect-ratio features, interconnects, micro-coils, and shielding structures.
• Applications: MEMS inductors, RF devices, structural reinforcement, and micro-actuators.
• Thermal Oxidation: Dry and wet oxidation of silicon for precise SiO₂ layer growth, ensuring high-quality insulating and passivation layers.
• Applications: device isolation, gate oxides, surface passivation, and microfluidic channel sealing.
• LPCVD (Low Pressure Chemical Vapor Deposition): Deposition of SiO₂, SiNₓ, polysilicon, and amorphous silicon with excellent step coverage and film uniformity.
• Applications: sacrificial layers, structural layers, stress-control films, and waveguide cores.
• PECVD (Plasma Enhanced Chemical Vapor Deposition): SiO₂ and SiNₓ films deposited at lower temperatures, ideal for applications requiring compatibility with polymers and temperature-sensitive substrates.
• Applications: encapsulation layers, dielectric layers, optical coatings.
• E-beam Evaporation: High-purity deposition of metals and conductive oxides, including Cr, Al, Ni, Au, Pt, Mo, Cu, and ITO.
• Applications: electrodes, reflective coatings, adhesion layers, biosensor interfaces, and optoelectronic devices.
• Sputtering: Deposition of Cr, Al, Ni, Au, Pt, Cu, ITO, and more, offering strong adhesion and excellent control over film thickness and uniformity.
• Applications: seed layers, transparent conductors, interconnects, and barrier films.
Applications Across Markets: These processes collectively support the fabrication of MEMS sensors and actuators, RF communication devices, photonic waveguides, microfluidic chips, and bio-MEMS platforms. By combining electroplating, oxidation, CVD, and PVD methods, we give customers the flexibility to build both structural and functional device layers tailored to their application.
MEMS Foundry
MEMS Foundry