Photolithography is one of the most critical processes in MEMS fabrication, defining the patterns that ultimately shape microstructures and devices. The flexibility to work with different photoresists, mask strategies, and resolution requirements allows developers to tailor fabrication for both prototyping and high-volume manufacturing.

At B-Micron, we offer a comprehensive photolithography toolkit that covers a wide range of methods and materials to meet diverse project needs:

• Dry film resists (e.g., MS7050, MS7100) for fast, uniform coating on larger areas and cost-effective prototyping.

• Positive resists (e.g., AZ GXR601, AZ9260, AZ4330, KL6000, K-pro) for high-resolution, flexible patterning with excellent process control.

• Negative resists (e.g., DNQ 30B, SU-8 series, AR-M series, JSR 151N) for thick film applications, high aspect ratios, and robust mechanical structures.

• Lift-off resists (e.g., AZ5124E, AZ nLOF) enabling clean patterning of metals and other materials without the need for etching.

• Shadow masking for direct material deposition in simple patterning scenarios without resist processing.

Our facility is designed to support both multi-layer lithography for complex MEMS structures and rapid single-layer processes for fast prototyping. By maintaining a diverse material library and advanced process control, we help customers select the optimal approach for their device requirements, whether for microfluidics, sensors, actuators, or photonics.

In keeping with our customer-first philosophy, B-Micron does not require upfront setup fees, lowering barriers for early-stage innovation while still supporting robust scale-up for production.

From thin, flexible films to thick, high-aspect-ratio patterns, our photolithography services ensure the precision and repeatability needed to bring microfabricated designs to life.