MEMS Foundry
Capability - Wet Etching
MEMS Foundry
Capability - Wet Etching
Wet etching is a cornerstone of MEMS and microfabrication, enabling precise removal of materials to define device geometries, release structures, or prepare surfaces for subsequent processing. Unlike dry etching, wet etching often provides smoother sidewalls, higher selectivity, and cost-effectiveness for certain applications.
At B-Micron, we support both non-metallic and metallic wet etching processes, allowing us to handle a broad spectrum of materials and device requirements:
• Non-metal etching: Silicon (TMAH, KOH), silicon dioxide (SiO₂), borofloat glass, quartz, silicon nitride (SiNₓ), and amorphous silicon (a-Si). These processes enable the fabrication of cavities, channels, membranes, and optical windows with high selectivity and controlled anisotropy.
• Metal etching: Chromium (Cr), titanium (Ti), gold (Au), copper (Cu), aluminum (Al), nickel (Ni), and more. We provide clean, controlled etch chemistries to pattern electrodes, interconnects, reflectors, and other conductive layers critical for MEMS, sensors, and photonics.
Our expertise extends to tailoring etching recipes for anisotropic or isotropic behavior, achieving sharp profiles or smooth undercuts depending on device needs. Combined with advanced masking strategies, this flexibility supports complex 3D structures such as through-silicon vias, suspended membranes, and precision electrodes.
In keeping with our no upfront setup fee policy, customers can access these capabilities without barriers, whether for quick prototyping or scaling into production.
By offering both silicon-based and metal etching under one roof, B-Micron ensures seamless integration across device layers—reducing turnaround times and enabling innovative MEMS, microfluidic, photonic, and sensor solutions.
Wet etching is a cornerstone of MEMS and microfabrication, enabling precise removal of materials to define device geometries, release structures, or prepare surfaces for subsequent processing. Unlike dry etching, wet etching often provides smoother sidewalls, higher selectivity, and cost-effectiveness for certain applications.
At B-Micron, we support both non-metallic and metallic wet etching processes, allowing us to handle a broad spectrum of materials and device requirements:
• Non-metal etching: Silicon (TMAH, KOH), silicon dioxide (SiO₂), borofloat glass, quartz, silicon nitride (SiNₓ), and amorphous silicon (a-Si). These processes enable the fabrication of cavities, channels, membranes, and optical windows with high selectivity and controlled anisotropy.
• Metal etching: Chromium (Cr), titanium (Ti), gold (Au), copper (Cu), aluminum (Al), nickel (Ni), and more. We provide clean, controlled etch chemistries to pattern electrodes, interconnects, reflectors, and other conductive layers critical for MEMS, sensors, and photonics.
Our expertise extends to tailoring etching recipes for anisotropic or isotropic behavior, achieving sharp profiles or smooth undercuts depending on device needs. Combined with advanced masking strategies, this flexibility supports complex 3D structures such as through-silicon vias, suspended membranes, and precision electrodes.
In keeping with our no upfront setup fee policy, customers can access these capabilities without barriers, whether for quick prototyping or scaling into production.
By offering both silicon-based and metal etching under one roof, B-Micron ensures seamless integration across device layers—reducing turnaround times and enabling innovative MEMS, microfluidic, photonic, and sensor solutions.
Wet etching is a cornerstone of MEMS and microfabrication, enabling precise removal of materials to define device geometries, release structures, or prepare surfaces for subsequent processing. Unlike dry etching, wet etching often provides smoother sidewalls, higher selectivity, and cost-effectiveness for certain applications.
At B-Micron, we support both non-metallic and metallic wet etching processes, allowing us to handle a broad spectrum of materials and device requirements:
• Non-metal etching: Silicon (TMAH, KOH), silicon dioxide (SiO₂), borofloat glass, quartz, silicon nitride (SiNₓ), and amorphous silicon (a-Si). These processes enable the fabrication of cavities, channels, membranes, and optical windows with high selectivity and controlled anisotropy.
• Metal etching: Chromium (Cr), titanium (Ti), gold (Au), copper (Cu), aluminum (Al), nickel (Ni), and more. We provide clean, controlled etch chemistries to pattern electrodes, interconnects, reflectors, and other conductive layers critical for MEMS, sensors, and photonics.
Our expertise extends to tailoring etching recipes for anisotropic or isotropic behavior, achieving sharp profiles or smooth undercuts depending on device needs. Combined with advanced masking strategies, this flexibility supports complex 3D structures such as through-silicon vias, suspended membranes, and precision electrodes.
In keeping with our no upfront setup fee policy, customers can access these capabilities without barriers, whether for quick prototyping or scaling into production.
By offering both silicon-based and metal etching under one roof, B-Micron ensures seamless integration across device layers—reducing turnaround times and enabling innovative MEMS, microfluidic, photonic, and sensor solutions.
MEMS Foundry
MEMS Foundry